|Phase Contrast Imaging|
|Phase-contrast imaging methods already proved to provide great enhancement in imaging of low absorbing materials. Talbot grating interferometry simultaneously yields three different contrast modalities, such as attenuation, differential phase and dark-field.|
|Ultrafast Radiography and Tomography|
|Ultrafast radiography is used to capture rapid processes in 2D X-ray movies. An optimized setup for high-speed tomography allows visualizing 3D dynamic processes in μm spatial resolution and sub-second time resolution.|
|Transmission X-ray Microscopy|
|The worldwide first cryogenic hard-X-ray microscope is employed for radiographic and tomographic scans using absorption contrast, phase contrast and/or X-ray fluorescence with a spatial resolution down to 10 nm/px.|
|X-ray Micro-Diffraction Imaging|
|X-ray micro-diffraction imaging allows for quantitative determination of local crystalline properties (tilt, strain, crystal quality) of large crystal areas with high resolution.|
|White beam topography is a powerful non-destructive technique for characterizing the μm- to cm-sized defect microstructure of crystals (resolution 1 μm/px).|
|Download Data Sheet_X-ray Topography and Wafermapping|
Motivated by the cooperation with the Fraunhofer Institute for Non-Destructive Testing, Dresden, ANKA together with ESRF (Grenoble, France) and KIT’s Laboratory for Applications of Synchrotron Radiation (LAS) has developed and established synchrotron laminography as a new method for X-ray imaging at synchrotron light sources.
Being an advancement of computed tomography (CT), computed laminography is combined with high-energy synchrotron radiation for three-dimensional imaging of strongly absorbing flat objects which cannot be accessed by visual inspection methods. High spatial resolution down to the micrometer scale can be attained, even for devices of macroscopically large lateral size. By the use of white radiation, a temporal resolution between successive 3D images on the scale of some seconds allows rapid scanning of large specimen areas with considerable inspection throughput.
As an application in material science, in situ laminography was used for a rapid and quantitative diagnosis of the early stage of failure in Pb-free flip chip solder joints due to electromigration induced void nucleation and growth. This in situ study of defect evolution and repair demonstrates the application potential of this non-destructive testing (NDT) technique for 3D quality assurance in microsystem technology.
In situ Synchrotron Radiation Computed Laminography (SRCL) for 3D imaging of damage evolution, voids formation in solder bumps (in collaboration with Prof. KingNing TU, UCLA, USA). 600 projections per laminographic scan recorded in 20 s (30 frames per s), image size is 0.6 mm. The images are 3D renderings of the reconstructed volume after 4.5h, 8.5h, 12h, and 12.5h of current load. Top four images are the contour of the 3D renderings. The bottom four images, corresponding to the top four ones, reveal inside voids of the solder bumps.
|You find here a paper from Applied Physiks A.|
|In addition to applying X-ray imaging techniques post processing of the related data is an important part of the expertise at ANKA. Interactive 3D reconstructions based on tomographic volumes allow for the virtual examination of μm-sized structures. They may facilitate the simulation of minute motion systems as exemplified here by digital model of a screw joint in the hip of a beetle.|
|Using optical flow methods a wide range of dynamical information can be quantitatively extracted from a time resolved series of 2D and/or 3D X-ray images. The examples presented here visualize the motion fields of a growing metal foam (left) and a feeding cockroach (right).|
|Using wafer mapping dislocations and defects can be identified that result from mechanical stress or may occur during crystallization. By stitching the acquired images complete wafers can be mapped with a 2,5 μm/px resolution.|
|The CT laboratory offers a broad range of analytical and methodological skills for our valued customers. Combining the capabilities of using synchrotron radiation and problem solving with conventional X-ray tools offers an interesting business field in the non-destructive testing area for industrial customers. Here, 3D analysis from sub micron to 100 µm resolution can be employed a process which covers most of the requests in our applications.|